Comments by "kazedcat" (@kazedcat) on "How TSMC Keeps Getting Better" video.

  1. It is already 3d printed at a much faster rate than macro scale 3d printing. The whole fabrication process is printing the 3d transistor structure on top of the silicon wafer then after that printing the 3d labyrinth of wiring on top of the 3d transistor so that they function as a logic circuit.
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  2. Vacuum does not mean free of contaminant. For example the etching process requires acids this acids can contain impurities. Coating process uses electrical discharged this can create unwanted free ions. Photo exposure uses plasma for a uniform light source this plasma can create killer particles. Even the containers use to transport wafers between tooling equipment can have out gassing that chemically react with the wafer. Out gassing becomes a lot more worst at lower pressures.
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