Comments by "Anders Juel Jensen" (@andersjjensen) on "The Extreme Engineering of ASML’s EUV Light Source" video.

The next phase is Large Aperture EUV. So same light source but much bigger mirrors with tighter focal points. This gives a smaller Critical Dimension. Small enough that there is no point going beyond that because quantum fuzziness will start fucking with us big time. So the next big leap is not to go smaller, but to go both more energy efficient on the transistors themselves and to start stacking multiple layers of transistor patterns. They're also researching using carbon nanotubes for connecting the transistors. Currently about 50% of a microprocessors power consumption is plain routing. Stacking things or connecting them with a much better conductor are both avenues to reclaim some of that loss.
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LOL! Yeah, solving the problem by shooting droplets of tin at black powder revolver speeds and hitting them twice with two different laser systems (with each their own complexities) sounds like a Nicola Tesla solution all right. Doing it 50,000 times a second without missing a beat?... That sounds more like Edison! :P
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Laser in itself does not cause debris. Hitting things so hard with lasers that they turn into plasma causes debris. They're basically "boiling" the tin droplets so hard they turn hotter than "white hot". Think "super heated tin steam". But once the temperature drops some it turns back into tin... where ever it ended up after being vaporized.
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@mostlymessingabout That's not going to prevent tin vapours from solidifying on them. Quite the contrary actually would be my guess.
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@Ubya_ AMD is already expienced with using the vias (the layer interconnecting "towers" of copper) to extract heat from the lower layers. They're pushing the first multi layer product to market early next year, so we'll see how it fares soon enough.
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