Comments by "" (@ntabile) on "The History of the Semiconductor Photomask" video.

  1. We remember resist overflow at the back of the wafer that caused e-clamping issue at our implanter with e- clamp type of chuck
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  2. Resist coating that has not been stripped well is the "enemy" of Implant as too much outgassing is experience in the early days of wafer manufacturing. We will just see the chamber and the surrounding area as full of resists by products that cause potential wafer scrappage due to particle during implant. Wafer patterns are scratched in a batch processing type of implant.
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