Comments by "kazedcat" (@kazedcat) on "AI’s Hardware Problem" video.

  1. CXL improves the memory capacity problem but not the memory bandwidth problem. The bandwidth problem is limited by the number of pins coming out from your CPU or GPU. TSV is the densest pin out technology we currently have and it is use to increase memory cache.
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  2.  @Fractal_32  RDNA3's high density fan out helps a little but for specialized high end AI hardware. The best solution is to use HBM memory which AMD will use in their next generation compute accelerator.
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  3. No SRAM is far larger. It will not reach DRAM level of cell density anytime soon.
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