Comments by "Anders Juel Jensen" (@andersjjensen) on "A Brief History of Semiconductor Packaging" video.

  1. You should check out AMD's patent for active interposers. It looks like it's both a stepping stone to 3D packaging and a packaging efficiency booster in one solution. The patent describes how to move the power rails management logic onto the interposer for a variety of benefits including shrinking the chip manufactured on the expensive node (by removing voltage control logic) and distributing thermal density (by having high-amp transistors away from the power hungry compute blocks) while also freeing up connection area needed for the chip-to-interposer integration. AMD specifically mentions it in conjunction with GPUs, but for this generation they've gone with micro film PCBs for connecting the MCDs to the GCD, so I suspect the price for 65nm wafers to use as interposers is still prohibitively expensive.
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