Comments by "genuinenness befitting" (@genuinennessbefitting4734) on "Financial Times" channel.

  1. In 2002, two Japanese companies, Nikon and Canon, monopolized the global lithography equipment market. At that time, ASML was still a tiny company surviving on orders from TSMC. Intel established the EUV LCC Alliance to develop lithography machines using American dry methods. Major manufacturers such as Motorola, AMD, and IBM were allowed to join the alliance, but TSMC was excluded from the EUV LCC alliance. Subsequently, TSMC took the initiative to cooperate with ASML, using the immersion lithography technology developed by TSMC to conduct research and development at F12B, the TSMC R&D headquarters in Hsinchu Science Park, Taiwan. At that time, there were two EUV R&D units worldwide, but the Intel EUV LCC alliance failed. TSMC spent 1 million wafers in testing at the F12b wafer fab and finally successfully created EUV to produce advanced chips.
    2
  2. If the US bombs TSMC, the US will go to hell, and the fab in AZ cost 40 billion and produce 20,000 wafers monthly, while TSMC produces 1,500,000 wafers monthly in Taiwan, and the US will need to spend multi-trillion to rebuild chip capacity, let alone the US lacks talent. Even if EUV is purchased, advanced chips cannot be mass-produced with a high yield rate. EUV uses TSMC's wet technology and is developed at F12b, TSMC's Hsinchu headquarters. TSMC modified the purchased EUV and redesigned the reflective structure to increase the reflectivity from 2% to 3% and increase the efficiency by 50%. TSMC's dry EUV mask cleaning technology reduces exposure to dust particles from hundreds to single digits per 10,000 wafers, a 99% reduction in dust ratios. ASML's latest EUV light source output power is 350W, but TSMC has begun using its own improved 350W EUV in 2020.
    1
  3. U.S. semiconductor technology lags because Intel has produced semiconductors since 1968 but has yet to break through advanced technology. Intel's failure in technological competition is the crux of the U.S. semiconductor problem. The United States has never handed over advanced semiconductor production to foreign countries because the United States does not have such technology.
    1
  4. Even if EUV is purchased, advanced chips cannot be mass-produced with a high yield rate. EUV uses TSMC's wet technology and is developed at F12b, TSMC's Hsinchu headquarters. TSMC modified the purchased EUV and redesigned the reflective structure to increase the reflectivity from 2% to 3% and increase the efficiency by 50%. TSMC's dry EUV mask cleaning technology reduces exposure to dust particles from hundreds to single digits per 10,000 wafers, a 99% reduction in dust ratios. ASML's latest EUV light source output power is 350W, but TSMC has begun using its own improved 350W EUV in 2020.
    1
  5.  @sneakymove  Taiwan has another option to join China. Not all Taiwanese are against unification with China. Your words will drive the DPP to lose the election in Jan.
    1
  6. Even if EUV is purchased, advanced chips cannot be mass-produced with a high yield rate. EUV uses TSMC's wet technology and is developed at F12b, TSMC's Hsinchu headquarters. TSMC modified the purchased EUV and redesigned the reflective structure to increase the reflectivity from 2% to 3% and increase the efficiency by 50%. TSMC's dry EUV mask cleaning technology reduces exposure to dust particles from hundreds to single digits per 10,000 wafers, a 99% reduction in dust ratios. ASML's latest EUV light source output power is 350W, but TSMC has begun using its own improved 350W EUV in 2020.
    1
  7. In 2002, two Japanese companies, Nikon and Canon, monopolized the global lithography equipment market. At that time, ASML was still a tiny company surviving on orders from TSMC. Intel established the EUV LCC Alliance to develop lithography machines using American dry methods. Major manufacturers such as Motorola, AMD, and IBM were allowed to join the alliance, but TSMC was excluded from the EUV LCC alliance. Subsequently, TSMC took the initiative to cooperate with ASML, using the immersion lithography technology developed by TSMC to conduct research and development at F12B, the TSMC R&D headquarters in Hsinchu Science Park, Taiwan. There were two EUV R&D units worldwide at that time, but the Intel EUV LCC alliance failed. TSMC spent 1 million wafers in testing at the F12b wafer fab and finally successfully created EUV to produce advanced chips.
    1
  8. Even if EUV is purchased, advanced chips cannot be mass-produced with a high yield rate. EUV uses TSMC's wet technology and is developed at F12b, TSMC's Hsinchu headquarters. TSMC modified the purchased EUV and redesigned the reflective structure to increase the reflectivity from 2% to 3% and increase the efficiency by 50%. TSMC's dry EUV mask cleaning technology reduces exposure to dust particles from hundreds to single digits per 10,000 wafers, a 99% reduction in dust ratios. ASML's latest EUV light source output power is 350W, but TSMC has begun using its own improved 350W EUV in 2020.
    1
  9. Due to the failure of the United States to suppress Taiwan's technology in 2002, EUV was successfully developed in Taiwan, and the era of artificial intelligence began. In 2022, two Japanese companies, Nikon and Canon, will monopolize the global lithography equipment market. At that time, ASML was still a small company surviving on orders from TSMC. Intel established the EUV LCC Alliance to develop lithography machines using American dry methods and adopt American lithography machine technology. Major manufacturers such as Motorola, AMD and IBM were allowed to join the alliance, but TSMC was excluded from the EUV LCC alliance. Subsequently, TSMC cooperated with ASML and used the immersion lithography technology developed by TSMC to conduct research and development at F12B, the TSMC R&D headquarters located in Hsinchu Science Park, Taiwan. At that time, there were two EUV R&D units in the world, but the Intel EUV LCC alliance failed. TSMC spent 1 million wafers in testing at the F12b wafer fab, and finally successfully created EUV to produce advanced chips. The United States has not invested a dime in the research and development of modern EUV, and not a single American engineer is involved in research and development. Immersion lithography technology is TSMC’s technology. If the United States did not have Taiwanese technology and Nvidia was founded by Taiwanese, could the United States still become a world hegemon?
    1
  10. Taiwan, not China, as all chip technologies developed in China are implemented by poached Taiwanese by China.
    1